Effect of nano diamond on thermal behavior and thermal stability of epoxy resin

Document Type : Review

Authors
Mohammad Hossein Karami 1
MohammadReza Kalaee 2
Ramin Khajavi 1
OMid Moradi 3
Davood Zaarei 1
1 Department of Polymer Engineering, Islamic Azad University, South Tehran Branch, P.O. Box 17776-13651, Tehran, Iran University, Tehran, Iran
2 1.Department of Polymer Engineering, Faculty of Engineering, South Tehran Branch, Islamic Azad University, P.O. Box: 19585-466, Tehran, Iran. 2.Nano Research Center, Islamic Azad University, South Tehran Branch.
3 Department of Chemistry, Shahre-Qods Branch, Islamic Azad University, Shahre-Qods 37515-374.
Abstract
Epoxy thermoset resins have been used in the composite, construction, electronics, adhesive and coatings industries due to their good thermal, electrical and chemical properties. Distribution and dispersion of nanoparticles in polymer matrix is an important and influential issue in the mechanical properties of epoxy nanocomposites. Curing kinetics equations are used to evaluate and optimize the production process, and degradation kinetics modeling has become widely used as an essential tool for engineers to reduce costs and product quality. Addition of modified carboxyl and amine groups to pure epoxy resin does not change the curing reaction mechanism and also modifying the surface of nanodiamond increases the curing rate of epoxy nanocomposite. Investigation of hybrid thermal stability of epoxy nanocomposites in the presence of nanodiamonds and graphene oxide showed that the simultaneous presence of two different types of nano material can increase the thermal stability. In this research, the effect of adding nano diamonds and modified nano diamonds on morphology, mechanical and rheological properties, and modeling of curing kinetics and degradation kinetics and tribological properties have been investigated.
Keywords
Nano diamond
Modified Nano diamond
Epoxy Resin
Thermal Properties
Modeling
 
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  • Receive Date 17 February 2022
  • Revise Date 26 April 2022
  • Accept Date 12 June 2022